Method for Manufacturing Cerium Dioxide Powders
Reduce Scratch Issues and Yield in Semiconductor Processes
Tags: National Taiwan University, Taiwan, Electronics & Robotics; Science & Exploration
This technology introduces a process for preparing nano-sized cerium dioxide (CeO2) particles, crucial for chemical mechanical polishing in the semiconductor industry, enhancing wafer surface planarization. It features a novel reaction design that produces powders with excellent crystallinity, dispersion, and nanosizes, operating at low temperatures and fast rates. The innovation aims to support the next-generation semiconductor processes, reducing scratch issues and increasing yield. This advancement addresses the increasing demands of wafer foundries in Taiwan, contributing significantly to the semiconductor sector's growth.
IP Type or Form Factor: Patent Granted; Process & Method; Material; Design
TRL: Not specified
Industry or Tech Area: Semiconductors; Nanotechnology
