Precisely Measure Quality in Semiconductor Packaging
Precisely Measure Quality in Semiconductor Packaging
Spectral Reflectometric Measuring Technique for High Aspect Ratio Microstructures
Tags: National Taiwan University, Taiwan, Electronics & Robotics, Industrial Automation & Manufacturing
This technology enhances semiconductor metrology with a new optical system using broadband light, enabling effective penetration for sub-micron via measurement. Integrated with AI and machine learning, it optimizes multi-critical dimension (CD) measurements, overcoming limitations of current methods. Industrial tests confirm its capability to accurately measure sub-micron vias and Redistribution Layers (RDLs), setting a new global standard in measurement precision. This breakthrough addresses the critical challenge of quality monitoring in advanced semiconductor packaging.
IP Type or Form Factor: Process & Method; Software & Algorithm
TRL: 5 - prototype ready for testing in intended environment
Industry or Tech Area: Semiconductors; Manufacturing Technology
